This document provides information about the board assembly of packages with optical sensor window. The lead-free solder balls allow for assembly by Surface Mount Technology (SMT). Laser based solderjet bumping is an innovative bonding technique to meet higher requirements compared to polymeric adhesives in terms of: The solder ball bumper integrates solder sphere feeding, reflow and placement of the solder bump as well as providing a localized inert nitrogen atmosphere in. Our laser solder jetting technology is clean, precise, and flexible. It works with. Laser solder ball jetting technology emerges as a pivotal solution, addressing the challenges of precision soldering while catering to the high-quality demands of users. However, because the solder balls under a BGA chip cannot be directly. Laser soldering has the features of non-contact heating, small heat diffusion, high heating efficiency, barrier avoidance soldering, quantitative supply of solder, high yield of soldering for dense pitch products, etc.
[PDF Version]