The invention provides an optical module multi-element COC eutectic method, which comprises the following steps: 1) Preheating a heating table; 2) A suction nozzle sucks the substrate preset with eutectic solder to a preheated heating table; 3) The suction nozzles. The invention provides an optical module multi-element COC eutectic method, which comprises the following steps: 1) Preheating a heating table; 2) A suction nozzle sucks the substrate preset with eutectic solder to a preheated heating table; 3) The suction nozzles. The attractive price and performance of EUTECT's titanium solder masks combine high-quality material selection with special surface treatment. Internationally leading brands in the industry rely on Aifotec's advice. With the develop-ment of our precision components which are “Made in Germany”, Aifotec. At present, the world's AI large-scale models have been released one after another and combined with industry applications to promote the smart upgrade of thousands of industries, and continue to drive the demand for optical chips, optical devices, and optical module in the upstream of the data. Eutectic bonding is one area of particular interest to photonics, microwave and RF electronics due to the need for a clean, highly thermally efficient process and for long-term reliability. This article, therefore, specifically focuses on the challenges and automation solutions related to eutectic. The EH9722 eutectic die bonder provides versatile die bonding solutions, support. lt is widely applicable toprocesses such as COC, COB, COS, and Flipchip, and provides.