AI Server Shortage Looms: MSG Maker Ajinomoto Cites ABF
Rising prices for ABF substrates, critical for AI servers, are forcing price hikes from major manufacturers like Ajinomoto.
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Rising prices for ABF substrates, critical for AI servers, are forcing price hikes from major manufacturers like Ajinomoto.
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Industry Chips Weekly 20260504 : IC Design + PCB Substrate Lock-in vs Panel Display Bull Trap This week showed extreme "bipolar strength/weakness." EDGE data shows smart money concentrated on
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Advertisements Driven by the relentless AI supercycle, the global advanced semiconductor packaging sector is grappling with a prolonged shortage of ABF substrates. Ajinomoto, the key
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"Taiwan''s thermal management suppliers are emerging as one of the fastest-growing segments in the AI hardware ecosystem" - From Last Month. "Vera Rubin server architecture is
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Server memory prices could double by the end of 2026, driven by manufacturers'' pivot to AI-focused production and Nvidia''s shift to smartphone
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A surge in demand for ABF substrates driven by AI applications has created ripple effects across the semiconductor packaging supply chain. Industry
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TrendForce offers hi-tech industry research reports, including market bulletins, industry analysis and price trends, helping businesses tackle global challenges
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The cost of advanced backside finless (ABF) substrates is set to climb sharply, with one major supplier announcing price increases of up to 30%. This shift reflects a deepening imbalance
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Mona Lisa Group, a Shenzhen-listed Chinese building ceramics company, hit another one-day limit-up on May 12, giving the stock three straight limit-up sessions. The rally was not driven by a
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The latest estimates suggest standard ABF substrate prices will increase by around 5% to 10% in the second half of 2026, while spot prices have already surged by more than 30%.
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H100 costs $3,320, B200 costs $6,400, GB200 costs $13,500. Full BOM breakdown: logic die, HBM memory, CoWoS packaging, and margins for 8 accelerators.
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Factory automation is already hereand maybe we''ll all have a humanoid bestie at some point in the future? 16. $SOI (Soitec) - their SOI & SmartSiC substrates are the enabling material for
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Samsung Electro-Mechanics begins price hike talks with Big Tech customers as AI-driven FC-BGA substrate demand exceeds capacity by 50%, while doubling investment for MLCC and
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ABF substrates are the core component of next-generation AI servers, and heightened demand is going to see their prices bumped by up to 30%.
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Higher substrate and packaging costs can feed into the price of AI servers, GPUs, CPUs, networking gear, and eventually broader PC hardware. The AI supercycle is stretching the
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The explosive growth in artificial intelligence (AI) servers and high-performance computing (HPC) is driving up the value of key components like ABF substrates. With ongoing bottlenecks in the
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The market for ABF substrates operates on two engines. On one side, high-volume PC demand accounts for the majority of ABF substrate consumption.
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It''s the substrate of AI cognition. So next time someone asks why Nvidia gets all the AI glory — remind them: behind every GPU is a memory chip doing the real heavy lifting. P.S.
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Advanced semiconductor packages using glass substrates will enhance high-performance computing and broaden their end markets to include
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According to ZDNet, South Korea''s substrate makers are facing mounting pressure from sharp increases in raw material prices. Citing industry
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As Nvidia''s next-gen AI server platform enters mass production, cloud service providers (CSPs) continue advancing their in-house ASIC development
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Last week, analysts at JPMorgan Chase & Co. raised their target prices for Murata and Taiyo Yuden, anticipating a prolonged tightness in supply-demand dynamics.
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The revenue contribution of generative AI in IC board sales is projected to exceed that of other areas (standard servers, PCs, etc.) in the near
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Industry suppliers are generally optimistic about ABF substrate market prospects for 2024 and 2025, citing the recovery of the PC market, as well as
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Transmission mechanism: Taiwan remains the center of AI foundry, advanced packaging, substrate, test, and server assembly capacity. This strengthens the earnings outlook for TSMC, ASE,
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Through Chiplet packaging technology, heterogeneous integration technology places individual chip designs from different processes and materials
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