Hermetic packaging for optical modules generally refers to enclosing optical chips (such as VCSEL, FP, DFB, PD, and APD) in a sealed cavity, which is filled with inert gas for protection. AIT engineered and designed several innovative lid-sealing solutions for optical, thermal, EMI and commercial component and module packaging with outstanding cost effectiveness. It is ideal for the MEMS and wafer level lid sealing applications. The following are some examples: AI Technology. Hermetic packaging, or sealing, is primarily used in electronic packaging (in particular in glass-to-metal seals) to protect sensitive components like electrical parts, optoelectronic chips, and semiconductors in vacuum-tight housings. It physically isolates the optical chips from moisture, oxygen, and other corrosive gases or liquids, thereby. Broadex Technologies Fiber Arrays are assembled with high precision V groove arrays and undergo a unique assembly and polish process to obtain an extremely accurate fiber core position with ultra fine surface finish. Leveraging advanced materials and automated processes, our products ensure superior optical signal integrity and long-term.
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