Intel's new chiplet co-packages these optical transceivers with the CPU on a single substrate, reducing the physical distance between the CPU and the optical components and thereby minimizing latency and power consumption during data transmission. Optical modules typically have an electrical interface on the side that connects to the inside of the system and an optical interface on the side that connects to the outside. In 2022, Intel reported its core device progress and future layout in the field of silicon photonics at OFC, and also announced its 400G DR4 and 800G 2xFR4 silicon photonics products. The picture below shows Intel's layout for photonic integration. The one on the left is the traditional panel. Intel claims the optical compute interconnect chiplet will "revolutionize high-speed data processing" of AI loads in data centers and HPC.
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